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 SI7447DP
New Product
Vishay Siliconix
P-Channel 30-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
-30
FEATURES
ID (A)
-24
rDS(on) (W)
0.006 @ VGS = -10 V
D TrenchFETr Power MOSFETS D New Low Thermal Resistance PowerPAKt Package with Low 1.07-mm Profile
APPLICATIONS
D Battery and Load Switching - Notebook Computers - Notebook Battery Packs
PowerPAKt SO-8
S
6.15 mm
S 1 2 3 S S
5.15 mm G
G 4
D 8 7 6 5 D D D
D
Bottom View P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a _ Pulsed Drain Current continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range TA = 25_C TA = 70_C PD TJ, Tstg TA = 25_C ID TA = 70_C IDM IS -4.5 5.4 3.4 -55 to 150 - 19 -60 -1.6 1.9 1.2 W _C -1 1 A
Symbol
VDS VGS
10 secs
Steady State
-30 "25
Unit
V
-24
-14
THERMAL RESISTANCE RATINGS
Parameter
t v 10 sec Maximum Junction-to-Ambienta Maximum Junction-to-Case (Drain) Notes a. Surface Mounted on 1" x 1" FR4 Board. Document Number: 71970 S-21475--Rev. A, 26-Aug-02 www.vishay.com Steady State Steady State RthJA RthJC
Symbol
Typical
18 50 1.0
Maximum
23 65 1.5
Unit
_C/W C/W
1
SI7447DP
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage VGS(th) VDS = VGS, ID = -250 mA VDS = 0 V, VGS = "20 V Gate-Body Leakage IGSS VDS = 0 V, VGS = "25 V VDS = -24 V, VGS = 0 V Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Forward Resistancea IDSS ID(on) rDS(on) gfs VSD VDS = -24 V, VGS = 0 V, TJ = 70_C VDS = -5 V, VGS = -10 V VGS = -10 V, ID = -24 A VDS = -15 V, ID = -24 A IS = -2.9 A, VGS = 0 V -30 0.0047 50 -0.71 -1.1 0.006 -1.0 -3.0 "100 nA "200 -1 -10 mA m A W S V V
Symbol
Test Condition
Min
Typ
Max
Unit
Transconductancea Voltagea
Diode Forward
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Gate Resistance Source-Drain Reverse Recovery Time Qg Qgs Qgd td(on) tr td(off) tf Rg trr IF = -2.9 A, di/dt = 100 A/ms VDD = -15 V, RL = 15 W ID ^ -1 A, VGEN = -10 V, RG = 6 W VDS = -15 V, VGS = -10 V, ID = -24 A 113 17 32.5 25 20 180 130 4 100 150 40 30 270 200 W ns ns 170 nC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
60 VGS = 10 thru 5 V 50 4V 50 60
Transfer Characteristics
I D - Drain Current (A)
40
I D - Drain Current (A)
40
30
30
20
20
TC = 125_C 25_C -55 _C
10
3V
10
0 0 1 2 3 4 5
0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
VDS - Drain-to-Source Voltage (V) www.vishay.com
VGS - Gate-to-Source Voltage (V) Document Number: 71970 S-21475--Rev. A, 26-Aug-02
2
SI7447DP
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
0.010 10000
Vishay Siliconix
Capacitance
r DS(on) - On-Resistance ( W )
0.008 C - Capacitance (pF)
8000 Ciss
0.006
VGS = 10 V
6000
0.004
4000
0.002
2000 Crss
Coss
0.000 0 10 20 30 40 50
0 0 6 12 18 24 30
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
10 V GS - Gate-to-Source Voltage (V) VDS = 15 V ID = 24 A 1.6
On-Resistance vs. Junction Temperature
VGS = 10 V ID = 24 A
6
r DS(on) - On-Resistance (W) (Normalized) 40 60 80 100 120
8
1.4
1.2
4
1.0
2
0.8
0 0 20
0.6 -50
-25
0
25
50
75
100
125
150
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
100 0.020
On-Resistance vs. Gate-to-Source Voltage
10
TJ = 150_C
r DS(on) - On-Resistance ( W )
0.016
I S - Source Current (A)
0.012 ID = 24 A 0.008
TJ = 25_C 1
0.004
0.1 0.00 0.2 0.4 0.6 0.8 1.0 1.2 VSD - Source-to-Drain Voltage (V)
0.000 0 2 4 6 8 10
VGS - Gate-to-Source Voltage (V)
Document Number: 71970 S-21475--Rev. A, 26-Aug-02
www.vishay.com
3
SI7447DP
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
0.6 200
Single Pulse Power
0.4 V GS(th) Variance (V) ID = 250 mA 0.2 Power (W)
160
120
0.0
80
-0.2
40
-0.4 -50
-25
0
25
50
75
100
125
150
0 0.001
0.01
0.1 Time (sec)
1
10
TJ - Temperature (_C)
Safe Operating Area
100 Limited by rDS(on) 10 I D - Drain Current (A) 10 ms 100 ms 1s TC = 25_C Single Pulse 10 s dc 1 ms
1
0.1
0.01 0.1 1 10 100
VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
0.2
Notes:
0.1 0.1 0.05
t1 PDM
0.02
t2 1. Duty Cycle, D =
2. Per Unit Base = RthJA = 50_C/W
t1 t2
Single Pulse 0.01 10- 4 10- 3 10- 2 10- 1 1 Square Wave Pulse Duration (sec)
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
www.vishay.com
4
Document Number: 71970 S-21475--Rev. A, 26-Aug-02
SI7447DP
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Vishay Siliconix
Normalized Thermal Transient Impedance, Junction-to-Case
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
0.2 0.1 0.1 Single Pulse 0.05 0.02
0.01 10- 4 10- 3 10- 2 10- 1 Square Wave Pulse Duration (sec) 1 10
Document Number: 71970 S-21475--Rev. A, 26-Aug-02
www.vishay.com
5


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